Asian Future Leaders Scholarship Program Application Guide

Asian Future Leaders Scholarship Program Application Guide

July11, 2014

The Asian Future Leaders Scholarship Program (AFLSP) is a full scholarship program designed to promote interaction among the young people of Asia. It was established through the generosity of Mr. Ronald K. Y. Chao (vice chairman, Novel Enterprises Limited) of Hong Kong, and is administered by Bai Xian Education Foundation Limited and Bai Xian Asia Institute Limited. Commencing operation in 2014, AFLSP aims to support young Asians wishing to undertake study abroad within the Asia-Pacific region, advance cross-cultural understanding, and foster individuals capable of contributing to goodwill and development both in Asia and globally in the future. Six universities in Japan and China, including Kyoto University, have been chosen as anchor universities for the AFLSP. These universities, together with other institutions participating in the program, shall select the scholarship recipients each year.

* Please refer to the application guidelines for application.

Eligibility Requirements

  1. Supportive of the AFLSP's purposes, interested in international understanding and goodwill, and prepared to contribute.
  2. Citizenship of an Asian country other than Japan, and prospective status of residence in Japan of "College Student" at the time the scholarship is awarded (those with multiple citizenship of Japan and other country/ies are not eligible).
  3. Under 35 years of age at the time of application.
  4. Completed a bachelor's degree at a designated institution (Peking University, Tsinghua University, Fudan University, Zhejiang University, Shanghai Jiao Tong University, Xi'an Jiao Tong University, Nanjing University, University of Science and Technology of China), or expecting to complete such a degree by the beginning of the scholarship term.
  5. Expecting to enroll as a regular (degree-seeking) student (master's [post-doctoral], doctoral, 5-year doctoral, professional degree program) at a graduate school of Kyoto University in October 2014 or April 2015, and planning to complete that degree program in the standard number of years.
  6. Completed the screening procedures at the Kyoto University Admissions Assistance Office (AAO) by the beginning of the scholarship term.
  7. Recommended by a supervising university professor or by an individual of equivalent status.
  8. Capable of communicating in either Japanese or English.
  9. Able to participate in the Summer Enrichment Program (held annually over four weeks) and other exchange events held as part of the program during the scholarship term.
    Summer Enrichment Program 2015: August 2 - 29, 2015 in Hangzhou, China (tentative calendar)
  10. Not in receipt of scholarships from any other organization or government during the term of the scholarship.
  11. Not engaged in any casual employment or other work during the term of the scholarship unless granted permission.
  12. Never previously received an AFLSP scholarship.
  13. In genuine need of financial support.
  14. In sound physical and mental health, with high moral standards, and an outstanding academic record.

Scholarship amount

Annual amount: 25000 US dollars approximately (the scholarship shall be paid in Japanese yen)

Scholarship term

Maximum of two years

Number of recipients

Approximately 15

Application period

August 15 to midnight, September 15, 2014 (Japan time)


Recipients shall be selected by a screening of their application documents, followed by interviews. Announcement of scholarship recipients will be notified in

Application guidelines / Application documents

Please read the application guidelines thoroughly before you apply.

Application Guidelines

Application documents

  • Word format (zip) / PDF format (zip)
    (Application form / Letter of Recommendation / Declaration of Understanding and Agreement)


Keiko SASAKI (Ms.) AFLSP Coordinator,

International Student Mobility Division, Kyoto University
E-mail: AFLSP* (Please replace the * with @)
Telephone: +81-75-753-2488